XPG LANCER BLADE DDR5 5600 ECC 16GB
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About This Item
- 16 GB DDR5 ECC memory module with 5600 MHz clock speed
- Low-profile heatsink design for compact PC builds
- Built-in Power Management IC for enhanced power efficiency
- On-die ECC for real-time error correction and stability
- Supports Intel XMP 3.0 and AMD EXPO for easy overclocking
- 288-pin DIMM form factor with CAS latency of 45
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XPG LANCER BLADE | 16 GB DDR5 Memory Module with ECC
The XPG LANCER BLADE memory module 16 GB 1 x 16 GB DDR5 5600 MHz ECC delivers professional-grade stability for content creators, engineers, and power users who demand error correction alongside high-speed performance. This low-profile DDR5 module combines compact design with advanced power management and real-time error correction.
| Metric | Spec |
|---|---|
| Capacity | 16 GB (1 x 16 GB) |
| Memory Type | DDR5 |
| Speed | 5600 MHz |
| CAS Latency | 45 |
| ECC Support | Yes |
| Form Factor | 288-pin DIMM |
Compact low-profile design for small builds
The LANCER BLADE’s slim heatsink design fits perfectly in compact PC cases without interfering with tower CPU coolers. Its geometric lines add visual appeal while maintaining clearance for other components, making it ideal for SFF (Small Form Factor) builds where space is at a premium.
Enhanced power efficiency and stability
Built-in Power Management IC (PMIC) provides stable power delivery while operating at lower voltages than DDR4 modules. This translates to better power efficiency and reduced heat output, crucial for systems running 24/7 or in thermally constrained environments.
Professional-grade reliability with ECC
On-die error correcting code actively detects and corrects memory errors in real-time, preventing system crashes and data corruption. This feature is essential for professionals working with large datasets, financial applications, or any workload where data integrity is non-negotiable.
Future-proof platform support
The module supports both Intel XMP 3.0 and AMD EXPO profiles, ensuring compatibility with the latest Intel and AMD platforms. This dual-platform support means the memory will work seamlessly whether you’re building around an Intel or AMD CPU.
Made with premium components
High-quality ICs and PCBs deliver reliable performance and stable overclocking potential. The components are selected to meet the demands of discerning users who require consistent performance under heavy workloads.
Box contents
- XPG LANCER BLADE DDR5 memory module
- Blister packaging
Check before you buy
- Confirm your motherboard supports DDR5 memory and has available 288-pin DIMM slots
- Verify your CPU platform (Intel 600/700 series or AMD AM5) supports DDR5 at 5600 MHz
- Check your case clearance for the 33.8 mm height heatsink
- Confirm your system BIOS supports XMP 3.0 or EXPO profiles
Frequently Asked Questions
Q: Does this memory require ECC support from the CPU and motherboard?
A: Yes, ECC functionality requires both CPU and motherboard support. Check your platform specifications.
Q: Can I mix this module with non-ECC DDR5 memory?
A: Mixing ECC and non-ECC memory is not recommended and may cause system instability or prevent booting.
Q: What CAS latency can I expect when running at 5600 MHz?
A: The module runs at CAS 45 at 5600 MHz. Lower latencies may be possible through manual overclocking.
Q: Is this compatible with DDR4 motherboards?
A: No, DDR5 modules are not compatible with DDR4 motherboards due to different pin layouts and voltage requirements.
Q: Does the low-profile heatsink affect cooling performance?
A: The heatsink provides adequate cooling for typical loads while maintaining the compact profile. Performance users may prefer taller heatsinks.
The Consultant’s verdict & warranty
The XPG LANCER BLADE memory module 16 GB 1 x 16 GB DDR5 5600 MHz ECC is ideal for professionals and enthusiasts who need the data integrity benefits of ECC alongside modern DDR5 performance. Its compact design makes it suitable for small builds, while dual-platform support ensures broad compatibility. Covered by the standard Manufacturer Warranty.
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 45 |
| Memory voltage | 1.1,1.4 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Power | |
| Memory voltage | 1.1,1.4 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 45 |
| Memory voltage | 1.1,1.4 V |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Weight & dimensions | |
| Width | 33.8 mm |
| Depth | 133.3 mm |
| Height | 7.8 mm |
| Weight | 32.9 g |
| Package type | Blister |
| Packaging data | |
| Package type | Blister |
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