Kingston FURY Impact 8GB (1 x 8GB) 4800MT/s CL38 DDR5 SODIMM Laptop Memory
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About This Item
- 8GB (1 x 8GB) DDR5 262-pin SO-DIMM form factor engineered for notebooks and small-form-factor systems
- 4800 MT/s high-speed data transfer rate with CL38 CAS latency at an efficient 1.1 V
- Intel XMP 3.0 certification alongside Plug N Play automatic overclocking capabilities
- On-die ECC architecture for enhanced operational stability and data integrity
- Integrated heatsink cooling system paired with gold-plated lead contacts
- JEDEC standard compliant single-rank (1R) unbuffered design with SPD profile support
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Kingston FURY Impact – Responsive DDR5 Performance for Compact Systems
Upgrading your portable workstation or gaming rig is straightforward with the Kingston FURY Impact 8GB (1 x 8GB) 4800MT/s CL38 DDR5 SODIMM Laptop Memory. This single-module upgrade suits gamers, mobile creators, and professionals needing faster multitasking. Because DDR5 delivers higher baseline bandwidth than DDR4, your laptop handles heavy workloads with minimal latency. We recommend this module to eliminate system bottlenecks without complicating your setup.
Essential Hardware Metrics
| Metric | Spec. |
|---|---|
| Memory Type | DDR5 SODIMM (262-pin) |
| Module Capacity | 8 GB (1 x 8 GB) |
| Data Transfer Rate | 4800 MT/s |
| CAS Latency | CL38 |
| Voltage | 1.1 V |
| Overclocking Profiles | Plug N Play, Intel XMP 3.0 |
Why Choose Kingston FURY Impact 8GB (1 x 8GB) 4800MT/s CL38 DDR5 SODIMM Laptop Memory
Modern software demands higher throughput to prevent micro-stutter in games and delays during rendering. Operating at 4800MT/s, this module transfers data substantially faster than previous-generation DDR4 SODIMMs. As a result, your operating system responds faster under heavy load. In practice, background applications run smoothly while your primary tasks retain full system priority.
Low 1.1V Operating Voltage for Thermal Efficiency
Laptops operate within tight thermal envelopes. This module runs at a low 1.1V baseline, reducing overall heat generation inside your chassis. The integrated slim heatsink also disperses heat away from critical components. Therefore, your laptop maintains optimal boost clocks during extended work or gaming sessions.
On-Die ECC for Robust Data Integrity
System stability is critical when pushing mobile hardware. This DDR5 module incorporates On-Die ECC to correct bit errors directly inside the memory chip. Consequently, you experience fewer crashes during demanding calculations or extended rendering jobs.
Seamless Plug N Play and Intel XMP 3.0 Support
Configuring laptop memory should never require complex BIOS adjustments. This module features automatic Plug N Play overclocking, allowing it to reach 4800MT/s automatically. For systems with manual memory controls, Intel XMP 3.0 profiles provide pre-tuned timings for optimal stability.
System Compatibility Checklist
- Confirm your laptop or small-form-factor PC uses DDR5 SO-DIMM slots.
- Confirm your processor supports 4800MT/s memory speeds.
- Confirm your system motherboard accepts single-module 8GB configurations.
Frequently Asked Questions
Q: Will this RAM work in a DDR4 laptop?
A: No, DDR5 SODIMM modules use a distinct pin layout and do not fit DDR4 slots.
Q: Does this memory require manual BIOS tuning?
A: No, Plug N Play functionality automatically configures the module to run at its rated speed.
Q: Can I add another 8GB module later?
A: Yes, you can install a matching module later to enable dual-channel memory performance.
Q: Is this memory suitable for mini PCs?
A: Yes, it fits any small-form-factor desktop that requires standard 262-pin DDR5 SODIMM memory.
Technical Consultant Summary
The Kingston FURY Impact DDR5 SODIMM offers a dependable, low-power upgrade for modern laptops and mini PCs. It delivers higher bandwidth, improved error correction, and effortless installation for daily computing and gaming.
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 8 g |
| Package weight | 26.72 g |
| Packaging data | |
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Package weight | 26.72 g |
| Logistics data | |
| Master (outer) case width | 196.8 mm |
| Master (outer) case length | 311.1 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 812.13 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
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