XPG LANCER BLADE 16GB DDR5 6000MT/s ECC Memory

£245.40 inc VAT

10 in stock

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About This Item

  • 16 GB DDR5 ECC memory module
  • 288-pin DIMM form factor
  • 6000 MT/s memory data transfer rate
  • CAS latency 30
  • 1.35 V operating voltage
  • Low-profile heatsink design
  • Intel XMP 3.0 and AMD EXPO support

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Description

XPG LANCER BLADE DDR5 | Compact High-Performance Memory

The XPG LANCER BLADE memory module 16 GB 1 x 16 GB DDR5 6000 MT/s 288-pin DIMM ECC delivers exceptional performance in a low-profile design, making it ideal for compact PC builds without sacrificing speed or stability.

Slim Specs Table

Metric Spec.
Memory Size 16 GB
Memory Type DDR5
Data Transfer Rate 6000 MT/s
CAS Latency 30
Form Factor 288-pin DIMM
ECC Support Yes (On-Die)

Compact Low-Profile Heatsink Design

The LANCER BLADE features a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design, making it suitable for both compact and full-sized builds.

Enhanced Power Management

The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhances power supply stability. Its lower operating voltage also makes LANCER more power-efficient than DDR4, reducing heat output while maintaining peak performance.

Stability and Reliability

With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability. This feature is particularly valuable for users running demanding applications or maintaining system stability during intensive workloads.

Made with High-Quality Materials

High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers. The premium components contribute to the module’s durability and consistent performance under stress.

AMD EXPO and Intel XMP 3.0 Support

Support for AMD EXPO (Extended Profiles for Overclocking) and compatibility with the latest platforms ensures reliability and stability across different systems. With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.

Box contents

  • XPG LANCER BLADE DDR5 memory module
  • Blister packaging

Check before you buy

  • Confirm your motherboard supports DDR5 memory and has available 288-pin DIMM slots
  • Verify your system supports 6000 MT/s memory speed
  • Check CPU cooler clearance to ensure compatibility with the low-profile heatsink design
  • Confirm your power supply meets system requirements for DDR5 memory operation

Frequently Asked Questions

Q: Is this memory module compatible with both Intel and AMD platforms?

A: Yes, it supports Intel XMP 3.0 and AMD EXPO for compatibility with both platforms.

Q: What is the CAS latency of this memory module?

A: The CAS latency is 30, which is standard for DDR5 memory at this speed.

Q: Does this module have RGB lighting?

A: No, the LANCER BLADE features a sleek, non-RGB heatsink design for a clean aesthetic.

Q: Can I use this memory in a mini-ITX build?

A: Yes, the low-profile heatsink design makes it suitable for compact PC cases.

The Consultant’s verdict & warranty

The XPG LANCER BLADE DDR5 memory module 16 GB 1 x 16 GB DDR5 6000 MT/s 288-pin DIMM ECC is an excellent choice for users building compact systems who need high-performance memory with reliable stability features. Its low-profile design, power efficiency, and ECC support make it particularly suitable for gaming rigs and workstations where space and reliability are priorities. Covered by the standard Manufacturer Warranty.

Specifications
Memory
Package typeBlister
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)1 x 16 GB
Internal memory16 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency30
Memory voltage1.35 V
ECCYes
Internal memory typeDDR5
Power
Memory voltage1.35 V
Design
Cooling typeHeatsink
Technical details
Cooling typeHeatsink
Features
On-Die ECCYes
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)1 x 16 GB
Internal memory16 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency30
Memory voltage1.35 V
Cooling typeHeatsink
ECCYes
Internal memory typeDDR5
AMD Extended Profiles for Overclocking (EXPO)Yes
Memory data transfer rate6000 MT/s
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-20 - 65 °C
Weight & dimensions
Package width70 mm
Package depth170 mm
Package height12.2 mm
Width133.3 mm
Depth33.8 mm
Height7.8 mm
Weight32.92 g
Package typeBlister
Package weight51.64 g
Packaging data
Package width70 mm
Package depth170 mm
Package height12.2 mm
Package typeBlister
Package weight51.64 g
Identifiers
Distributor SKUsAX5U6C316SLABBK

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