Team Group VULCAN 32GB (2x16GB) DDR5
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About This Item
- 32 GB DDR5 memory kit (2 x 16 GB) for PC systems
- 288-pin DIMM form factor with 6000 MHz memory clock speed
- CAS latency 38 and 1.25 V memory voltage
- Intel XMP 3.0 support for one-click overclocking
- Unregistered (unbuffered) memory type with On-Die ECC
- Heatsink cooling with reinforced aluminium structure
- Box package with compact 140 mm depth and 32.7 mm height
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Team Group VULCAN | DDR5 Performance Memory
The Team Group VULCAN memory module 32 GB 2 x 16 GB DDR5 is engineered for PC builders seeking reliable high-speed performance. This dual-channel kit delivers a substantial capacity upgrade for modern systems. It features a sleek, low-profile heatsink design that fits easily into most builds. Because it uses unregistered memory, it is suited for consumer desktop platforms. So, it offers a practical balance of speed, stability, and visual appeal for gamers and creators.
Technical Specifications Overview
| Metric | Spec. |
|---|---|
| Memory Type | DDR5 |
| Capacity | 32 GB (2 x 16 GB) |
| Speed | 6000 MHz |
| Voltage | 1.25 V |
| CAS Latency | 38 |
| Form Factor | 288-pin DIMM |
Efficient Thermal Management
The VULCAN module uses a robust aluminium heatsink for effective cooling. TEAMGROUP applies professional-grade thermal conducting silicon between the fins and memory. This ensures rapid heat transfer from the components to the heatsink. Consequently, the memory maintains optimal temperatures during demanding tasks. This design supports consistent performance without thermal throttling.
One-Click Overclocking with Intel XMP 3.0
This memory kit supports Intel XMP 3.0 for straightforward overclocking. You can enable the rated 6000 MHz speed with a single BIOS click. This simplifies performance tuning for users who avoid manual adjustments. However, you must verify your motherboard and CPU support XMP 3.0. Always check your motherboard QVL for compatibility before purchase.
Stable Power and On-Die ECC
The module includes a Power Management IC (PMIC) for stable voltage delivery. This minimises noise interference across your system components. It also features On-Die ECC for error detection and correction. While standard ECC is not present, On-Die ECC helps maintain system stability. This is crucial for prolonged gaming or rendering sessions.
Reinforced Construction and Design
TEAMGROUP moulds the heatsink from a single block of aluminium alloy. The top structure is secured with a snap fastener for added rigidity. This reinforced design protects the memory ICs from physical stress. The multi-angular profile provides a sleek aesthetic for windowed cases. It combines durability with a clean, modern look.
Box contents
- 2 x Team Group VULCAN DDR5 memory modules
- Protective packaging box
Check before you buy
- Confirm your motherboard supports DDR5 288-pin DIMM slots.
- Verify your CPU and motherboard support Intel XMP 3.0 profiles.
- Check physical clearance for the module height (32.7 mm) near CPU coolers.
- Ensure your system BIOS is updated for DDR5 compatibility.
Frequently Asked Questions
Q: Is this memory compatible with AMD systems?
A: It is designed for Intel XMP 3.0. Check your AMD motherboard’s QVL for DDR5 6000 MHz support.
Q: Does this kit support ECC functionality?
A: It features On-Die ECC for internal error correction but does not support standard server-grade ECC.
Q: What is the physical height of the module?
A: The module height is 32.7 mm, which is a low-profile design that fits most air coolers.
Q: Can I mix this with other DDR5 modules?
A: For best results, use identical kits. Mixing may prevent XMP from enabling correctly.
The Consultant’s verdict & warranty
This kit is ideal for UK PC gamers and content creators building a new DDR5 system who want reliable 6000 MHz performance without complex tuning. It suits builds where low-profile cooling and stable power are priorities. Covered by the standard Manufacturer Warranty.
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.25 V |
| ECC | No |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| Power | |
| Memory voltage | 1.25 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.25 V |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| Weight & dimensions | |
| Width | 7.5 mm |
| Depth | 140 mm |
| Height | 32.7 mm |
| Package type | Box |
| Packaging data | |
| Package type | Box |
| Identifiers | |
| Distributor SKUs | SDTEA-FLBD532G60, FLBD5326C38ADC1 |

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