XPG LANCER BLADE 32GB DDR5 2x16GB DIMM
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About This Item
- 32 GB DDR5 memory capacity with 2 x 16 GB modules
- 6400 MHz memory clock speed with CL39 latency
- 288-pin DIMM form factor for PC systems
- Compact low-profile heatsink design for smaller cases
- AMD EXPO and Intel XMP 3.0 overclocking support
- Built-in Power Management IC for enhanced stability
- On-die ECC for real-time error correction
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XPG LANCER BLADE | Compact DDR5 DIMM Kit
This review covers the XPG LANCER BLADE memory module 32 GB 2 x 16 GB DDR5 288-pin DIMM. It targets PC builders needing high-speed memory. The key USP is the low-profile heatsink design. It fits easily into tight cases. This kit suits compact builds where space is premium. It offers 6400 MHz speed for modern systems.
Technical Profile
Here are the critical metrics for this memory kit. We selected these based on performance impact. The table omits unspecified details to ensure accuracy.
| Metric | Spec. |
|---|---|
| Total Capacity | 32 GB |
| Kit Configuration | 2 x 16 GB |
| Memory Type | DDR5 |
| Speed | 6400 MHz |
| Form Factor | 288-pin DIMM |
| CAS Latency | 39 |
Space-Saving Thermal Design
The heatsink stands only 7.8 mm tall. This low profile prevents contact with tower CPU coolers. It is ideal for small form factor (SFF) cases. The geometric design aids airflow. In practice, this maintains stable temperatures. It fits builds where clearance is limited.
High-Speed DDR5 Performance
This kit runs at 6400 MHz. It uses the latest DDR5 internal memory type. The speed benefits gaming and multitasking. However, this listing specifies single-channel memory. This may limit bandwidth compared to dual-channel setups. Verify your motherboard supports this speed.
Enhanced Power Management
A built-in Power Management IC (PMIC) is included. This enhances power supply stability. It operates at a lower voltage than DDR4. Consequently, the kit is more power-efficient. This contributes to system reliability during heavy loads.
Stability and Error Correction
The module features On-die ECC. This corrects errors in real-time. It provides increased stability without user intervention. High-quality ICs and PCBs support reliable overclocking. This suits discerning users who demand consistency.
Overclocking Profiles
The kit supports AMD EXPO. It also supports Intel XMP 3.0. These profiles allow easy overclocking via BIOS. You avoid manual parameter adjustments. However, confirm compatibility with your specific CPU and motherboard platform.
Box contents
- 2 x 16 GB DDR5 DIMM modules
- Low-profile heatsink (pre-installed)
Check before you buy
- Confirm your motherboard has 288-pin DIMM slots.
- Verify BIOS support for DDR5 6400 MHz.
- Check physical clearance for the 7.8 mm height.
- Confirm AMD EXPO or Intel XMP 3.0 support.
Frequently Asked Questions
What is the exact memory speed of this kit?
Does this kit support dual-channel mode?
Is the heatsink removable?
What is the CAS latency?
Is this compatible with Intel or AMD?
Why we rate it
This XPG kit is best for SFF PC builders. It suits users prioritising compact fit over dual-channel bandwidth. The low height solves clearance issues. The DDR5 speed supports modern workloads. However, verify single-channel suitability for your specific use case. Covered by the applicable manufacturer warranty.
| Memory layout modules x size | 2 x 16 GB |
|---|---|
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 39 |
| Memory channels | Single-channel |
| Memory clock speed | 6400 MHz |
| Operating temperature T-T | 0 – 85 °C |
| Width | 133.3 mm |
| Depth | 33.8 mm |
| Height | 7.8 mm |
| Weight | 36.2 g |
| Distributor SKUs | 559500, AX5643216DTLABK |

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